Micro-Fluidic and Micro-Electromechanical System Applications: Subtractive Processing of Glass Substrates

The reference text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices. It covers the fabrication of multiple hole arrays for interconnects, surface roughening of glass for microsystems packaging applications, and fabrication, and characterization of through-glass via for micro-electromechanical system packaging applications.

This book:

• Presents an overview of subtractive technologies needed to process glass materials for micro-fluidic, and micro-electromechanical system applications
• Discusses the latest developments in advanced machining techniques based on mechanical energy, chemical energy, plasma energy, and high-temperature methods
• Covers post-processing techniques employed to facilitate the machined glass substrates for the micro-electromechanical system, micro-fluidic, and lab-on-chip applications
• Explains advanced techniques such as nonconventional machining processes, hybrid, and sequential machining methods to process glass
• Illustrates topics such as photoacoustic biosensing, cantilever beam temperature sensor, and parametric effect on machined micro-channels

It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, mechanical engineering, production engineering, materials science, and engineering.