Mathematics and Science, Physics, Applied Physics

11th International Congress Molded Interconnect Devices - Scientific Proceedings

Jörg Franke (editor-in-chief), Thomas Kuhn (editor-in-chief), Albert Birkicht (editor-in-chief), Andreas Pojtinger (editor-in-chief)

Product available on: 26/11/2014

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Synopsis

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

Publisher information

Publisher: Trans Tech Publications Ltd
ISBN: 9783037959480
Number of pages: 130
Dimensions: 142 x 125 x 10 mm
Languages: English